ECO3 Sn97/Cu3 B5 SOLDER ALUMINUM
LEAD FREE WIRE
WITH FLUX FOR ALUMINUM SOLDERING
- Description
- Additional information
Description
Our solder paste BROPASTE ELECTRONIC TRIMETAL-AG, ROL0 SMD
complies with the standard UNE-EN ISO 9453 alloy 179, formulation of solder paste without halides, NO CLEAN and with better settlement to avoid the formation of bridges and beads. The standard alloy, SnPb36Ag2, is especially suitable for reflow and vapor phase processes. This paste can be processed with or without the use of nitrogen. Contains lead. PACKAGING n Syringe 30g n Syringe 100g n Syringe 150g n Plastic jar 250g n Plastic jar 500g n Small cartridge 600g n Large cartridge 1200
Additional information
Application | Soldering, Electronic, Hand & Robotic Soldering, Re-work |
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Composition | Sn97 Cu3 |
Flux Content | YES |
Lead Free | YES |